FOWLP
FOWLP (Fan-Out Wafer-Level Packaging) is one of the most advanced semiconductor packaging technologies used today in mobile devices, automotive electronics, IoT systems, and high-performance computing. It offers a powerful combination of high performance, ultra-thin form factor, excellent thermal behavior, and lower manufacturing cost compared to traditional packaging technologies.
What Is FOWLP?
FOWLP is a next-generation packaging method where the individual dies are embedded into a reconstituted wafer and then connected using redistribution layers (RDL). Unlike fan-in WLP, the chip’s connections “fan out” beyond the die area, allowing more I/O pads, better routing, and superior electrical performance.
This makes FOWLP ideal for applications that demand miniaturization, high speed, and energy efficiency.
Related Articles
- Development and Optimization of Fine-Pitch RDL for RDL Interposer, and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology
- Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging
Related Blogs
- What Is 3D-IC Technology? Fundamentals, Architecture, and Design Concepts
- Understanding Signal Integrity in Chiplet Design
Related News
- Veeco Announces Multiple Orders for Wet Processing and Lithography Systems to Support Advanced Packaging and Silicon Photonics at a Leading Semiconductor Foundry
- EV Group Brings Digital Lithography to Heterogeneous Integration HVM Applications with LITHOSCALE® XT
- EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2025
- Veeco Announces Over $35 Million in Advanced Packaging Lithography System Orders From IDM & OSAT Customers
- Brewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council (CMC) Conference
Featured Content
- Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
- 2026 Predictions from Alpahwave Semi, now part of Qualcomm
- CoAsia SEMI Commences Supply of 3D IC SoCs: Korea’s First Case, Positioning 3D IC as the Next HBM
- Eliyan Secures $50 Million in Strategic Investments from Leading Hyperscalers and AI Infrastructure Providers to Accelerate Scalable AI Systems
- Lifecycle Cost-Effectiveness Modeling for Redundancy-Enhanced Multi-Chiplet Architectures
- Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics
- DISTIL: A Distributed Spiking Neural Network Accelerator on 2.5D Chiplet Systems
- Building out the Photonic Stack
- Lightmatter Introduces Guide Light Engine for AI, Featuring VLSP Technology
- Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers
- Lightmatter Collaborates with Synopsys to Integrate Advanced Interface IP with Its Passage Co-Packaged Optics Platform
- Lightmatter and Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure
- Hybrid Bonding Comes of Age Slowly and Collectively
- Tenstorrent Announces Participation in CHASSIS Program
- LIGENTEC and X-FAB Expand Integrated Photonics Offering with SOI and Thin-Film Lithium Niobate Volume Scaling