2.5D Integration
2.5D Integration is an advanced semiconductor packaging technique that places multiple chips or chiplets side-by-side on a high-performance interposer, allowing them to communicate at extremely high speeds. It’s called “2.5D” because it offers many of the benefits of full 3D stacking—such as high bandwidth and lower power—without requiring chips to be stacked directly on top of each other.
In simple terms, 2.5D Integration is like placing several powerful chips on one ultra-fast “circuit board” made of silicon or other materials, enabling them to work together as a unified system.
Related Articles
- TDPNavigator-Placer: Thermal- and Wirelength-Aware Chiplet Placement in 2.5D Systems Through Multi-Agent Reinforcement Learning
- DISTIL: A Distributed Spiking Neural Network Accelerator on 2.5D Chiplet Systems
- Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning
- High-Efficient and Fast-Response Thermal Management by Heterogeneous Integration of Diamond on Interposer-Based 2.5D Chiplets
- Inter-chip Clock Network Synthesis on Passive Interposer of 2.5D Chiplet Considering Transmission Line Effect
Related Blogs
Related News
- Onto Innovation’s Dragonfly® G5 System Qualified for Applications in 2.5D AI Packaging
- Avalanche Technology and NHanced Semiconductors Leverage Advanced 2.5D Integration to Bring Optimal SWaP and Reliability to Rad-Hard FPGAs
- imec: New Methods for 2.5D and 3D Integration
- Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
- Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks
Featured Content
- CCD-Level and Load-Aware Thread Orchestration for In-Memory Vector ANNS on Multi-Core CPUs
- POET Technologies and Lumilens Advance Wafer-Level Photonic Integration for Next-Generation AI Optical Networks
- A Review of Multiscale Thermal Modeling in Heterogeneous 3D ICs
- Tower Semiconductor Signs Customer Contracts for $1.3 Billion Silicon Photonics Revenue for 2027
- IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
- EXTOLL announces Availability of Industry's first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
- Spying Across Chiplets: Side-Channel Attacks in 2.5/3D Integrated Systems
- NHanced Semiconductors & the University of Florida to Present on Hybrid Bonding Reliability at the 2026 Electronic Components & Technology Conference in Orlando
- Wafer-Scale vs. Chiplets: The new war?
- Wooptix Targets AI Packaging Bottleneck with Astronomy Tech
- Kenyi Technologies to collaborate with ADTechnology to co-develop a Server Processor targeting Edge AI and Telco use cases
- Tawazun and Lockheed Martin Sign Strategic Agreement to Establish UAE's Chiplet Design and Assembly Facility
- Chiplets 101: An Arteris Guide to Multi-Die Architecture
- Chiplets Modularity for AI and HPC
- Athos Silicon mSoC™ | A New Compute Architecture for Physical AI