Splitting the Die A Modular Approach to Chiplet Design and Verification

By Mark Knight, Director of Product Management , Arm

AI is accelerating demand for scalable, modular silicon—driving a shift toward multi-die systems built from interoperable chiplets. A viable chiplet marketplace requires standardization that enables chiplets to be reused across systems developed independently by different vendors. This session examines the challenges of adapting monolithic SoCs to modular architectures, with a focus on the design, verification, and system integration standards needed to enable reliable multi-vendor chiplet composition. It also introduces the Arm Chiplet System Architecture, a specification that enables Arm-based systems to be cleanly partitioned across dies using standard interfaces and protocols. The talk will highlight how these foundations support a composable approach to silicon—aligning with the needs of next-generation AI systems and accelerating the creation of an open, reusable chiplet ecosystem.