From the Shadows to the Spotlight – Probe’s Role in Enabling Electronics Industry Innovation
By Mike Slessor, Chief Executive Officer at FormFactor Inc.
Once thought of as a relatively simple test insertion, probe today is anything but simple. Increasing performance and capability has been driven by probe’s ascent to a key enabler for economically-viable semiconductor manufacturing at the leading edge, especially for advanced-packaging architectures that rely on 2.5-D and 3-D stacking of chiplets. We will explore the factors driving increased performance and capability in probe applications from high-bandwidth-memory DRAM, through high-performance-compute xPUs, to even co-packaged electro-optical silicon photonics.
International Test Conference 2024 Keynote
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