From the Shadows to the Spotlight – Probe’s Role in Enabling Electronics Industry Innovation

By Mike Slessor, Chief Executive Officer at FormFactor Inc.

Once thought of as a relatively simple test insertion, probe today is anything but simple. Increasing performance and capability has been driven by probe’s ascent to a key enabler for economically-viable semiconductor manufacturing at the leading edge, especially for advanced-packaging architectures that rely on 2.5-D and 3-D stacking of chiplets. We will explore the factors driving increased performance and capability in probe applications from high-bandwidth-memory DRAM, through high-performance-compute xPUs, to even co-packaged electro-optical silicon photonics.

International Test Conference 2024 Keynote