Linking Semiconductor Design to Manufacturing for a Sustainable Future
Semiconductor sustainability is heavily impacted by design decisions, especially as the industry transitions to heterogeneous chiplet integration using 2.5/3D substrates for continued scaling. Linking digital twins of semiconductor design and fabs allows a bi-directional flow - design details optimize fabs for sustainability, while manufacturing data optimizes design libraries and decisions.
Listen in as EE Times' Sally Ward-Foxton and Siemens EDA's Michael Munsey discuss - Semiconductor design: Linking design to manufacturing for a sustainable semiconductor future.
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related Videos
- DreamBig Semiconductor's Journey From Seed to Series B Funding for Their Multi-Die AI Chiplet
- China Target Chiplet, will it be a shortcut for China semiconductor self sufficiency？
- Why chiplet will transform the semiconductor ecosystem from design to packaging?
- Enabling a true open ecosystem for 3D IC design
Latest Videos
- Securing the Open Chiplet Ecosystem Defining a Common Security Architecture for FCSA
- Security of Multi chip ICs & Security Chiplets with Caliptra Building a Hardware Root of Trust
- System level standards for Multi vendor chiplet interoperability
- Die to Die Solutions for Optical Chiplets
- Building Interoperable AI Systems with Chiplets Arm Neoverse and Cadence in an Open Ecosystem