DreamBig Semiconductor's Journey From Seed to Series B Funding for Their Multi-Die AI Chiplet
Steve Majors, Sr. VP of Engineering, discusses how DreamBig went from a lean startup to scale with their multi-die chiplet platform for AI datacenter applications. Learn what challenges they encountered during this journey from funding, hiring the right talent to finding their initial customers, and how they scaled their EDA environment on cloud to meet the needs and scale of a highly complex design.
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