Why chiplet will transform the semiconductor ecosystem from design to packaging?

By Emilie Jolivet, Business Line Director, Yole Group

In the last 5 years, we have witnessed worldwide efforts to develop innovative integration solutions that respond to the needs of power-efficient high- performance computing at cost compatible with the semiconductor industry. Chiplet enable the integration of specialized components, such as high-speed interconnects, memory, and accelerators, leading to improved system-level performance and efficiency. Fueled by the fast adoption of generative AI, 2.5D/3D architectures, the industry has geared up to chiplet adoption for years and has step by step removed the technical obstacles.  It’s not only about increasing computing performance in making CPU/GPU closer to the HBM memory through a silicon interposer, this has also been already available on the market for more than 10 years, but offering flexibility, modularity and re-use in design to achieve the most performant system. This presentation makes a retrospective of the emergence of chiplet in datacenters and consumer markets and draw the outlines of its widest adoption in the coming years.