Chiplets tackle semiconductor barriers
As semiconductor vendors wrestle with building more capable devices, they’re turning to innovations to manage cost, improve yields and get to market faster. Chiplets let them pull together the best capabilities from different processes and geometries and build better parts. John Abbott returns to discuss the benefits and where chiplets are being put to work with host Eric Hanselman. Driven by the efficiency and power demands of AI, they’re being used in next-generation GPU’s and processors.
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
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