Breaking Down Die Size Barriers with Chiplets
Why are hyperscalers moving towards chiplet ecosystems?
Anu Ramamurthy, Associate Research Fellow from Microchip Technology, and Open Chiplet Economy Sub-Project Co-Lead for Open Compute Project, explains:
- Large die sizes are reaching their physical limits, requiring division into smaller chiplets
- Chiplet architecture helps maintain high yields and lower costs while achieving needed computational power
- OCP enables multiple vendors to participate in the chiplet marketplace, expanding beyond proprietary solutions
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
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