Accelerate 3D IC designs with Innovator3D IC

As 3D IC adoption ramps up, one thing is clear: traditional, siloed 2D design flows can’t keep pace with the complexity of chiplet-based integration or multiphysics reliability.

That’s where Siemens EDA's Innovator3D IC steps in. It provides a unified cockpit for design planning, prototyping, and predictive multiphysics analysis. It constructs a 3D digital twin of the entire device that in turn drives implementation, multiphysics analysis, mechanical design, test, signoff, and release to fabrication and manufacturing.
 
Learn how our Innovator3D IC solution suite can help you:

• Streamline system planning and chiplet integration across dies, interposers, substrates and PCBs.
• Simulate thermal, power and stress impacts early to ensure reliable designs.
• Eliminate data silos with a secure, traceable flow from early exploration through manufacturing release.

3D IC design success demands high-quality, system-level planning from the very start. Whether you’re building AI accelerators or integrating HBM, the Innovator3D IC solution suite helps you minimize re-spin risk, scale with confidence, and accelerate time-to-market.