2026 Predictions from Alpahwave Semi, now part of Qualcomm
Tony Chan Carusone, Chief Technology Officer at Alphawave Semi, examines three critical shifts reshaping AI infrastructure in 2026. As the industry moves beyond the race for raw computing power, Chan Carusone identifies fundamental changes in how AI systems are designed, deployed, and scaled. He explores why power consumption is overtaking chip performance as the primary constraint, how AI clusters are expanding beyond single data centers into metro-scale networks, and why chiplet technology is transitioning from experimental to essential. This analysis reveals how the next generation of AI infrastructure will prioritize efficiency, geographic distribution, and modular design over traditional metrics.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- From ASIC Startups to Chiplets: Decades of Semiconductor Leadership and Innovation | Kash Johal
- Cost And Quality Of Chiplets
- Alphawave and Keysight: UCIe Compliance Validation Journey from System Simulation to Silicon
- Connectivity for AI Everywhere: The Role of Chiplets
Latest Videos
- 2026 Predictions from Alpahwave Semi, now part of Qualcomm
- Arm Viewpoints: Chiplets explained – the technology and economics behind the next wave of silicon innovation
- The State of Multi-Die: Insights and Customer Requirements
- Coding approaches for increasing reliability and energy efficiency of 3D technologies
- AI-Driven Thermal Prediction for Enhanced Reliability in 3D HBM Chiplets