Chiplets, RISC-V, and Europe's AI Silicon Ambition

Europe has the technical talent and research base to compete in advanced semiconductor design. Turning that into globally competitive AI and HPC systems takes more than investment. It needs scalable architectures, open ecosystems, and real collaboration across the supply chain.

In this episode of Tech Threads, Baya’s CCO, Nandan Nayampally talks with Cesc Guim, CEO of Openchip, about building next-generation processors and computing platforms in Europe — why chiplet-based design is becoming central to scalable, specialized architectures, and how RISC-V opens up flexibility that fixed-ISA approaches can’t match.

They also dig into the hardest problem in modern system design: moving data efficiently between processors, accelerators, memory, and chiplets. At scale, performance depends less on adding compute and more on getting the interconnect right — bandwidth, latency, and efficiency for demanding AI workloads.

Cesc also shares his take on the challenges and opportunities and the thrill of building a semiconductor company in Europe, forming the right technology partnerships, and turning regional ambition into products that compete globally.

In this episode:

• How Openchip is approaching AI and HPC system design
• Why chiplets are becoming central to scalable, specialized architectures
• Where RISC-V fits in enabling open, differentiated designs
• Why interconnect performance is the bottleneck for AI system efficiency
• How partnerships, especially with critical pieces like Baya’s IP, cut complexity, risk, and time-to-market
• What Europe needs to convert semiconductor investment into competitive products