Hardware Design and Security in the Era of Chiplets and LLMs
By Johann Knechtel 1, Ozgur Sinanoglu 1, Paul V. Gratz 2, Ramesh Karri 3
1 NYU Abu Dhabi
2 Texas A&M University
3 NYU Tandon School of Engineering

Abstract
The semiconductor industry is undergoing a dual revolution: the shift toward heterogeneous 2.5D chiplet systems and the integration of Large Language Models (LLMs) into Electronic Design Automation (EDA) flows. While these paradigms offer unprecedented benefits in yield, modularity, design productivity, etc., they radically expand the hardware attack surface. This paper provides a unified analysis of these frontiers, ranging from attacks on chiplet systems (including hardware stacks for LLM acceleration) across architectural, logical, and physical levels, to various exploits against LLM-driven EDA pipelines. To secure chiplet systems, we review a powerful defense approach that leverages 2.5D split manufacturing and active interposers for physically isolated Root of Trust (RoT) architectures. To secure LLM-driven EDA pipelines, we first identify native threats and then review state-of-the-art defense techniques. Finally, we discuss how LLM systems can advance hardware security efforts for modern systems, including chiplets.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related Technical Papers
- The Next Frontier in Semiconductor Innovation: Chiplets and the Rise of 3D-ICs
- Codesign of quantum error-correcting codes and modular chiplets in the presence of defects
- High-Efficient and Fast-Response Thermal Management by Heterogeneous Integration of Diamond on Interposer-Based 2.5D Chiplets
- The Revolution of Chiplet Technology in Automotive Electronics and Its Impact on the Supply Chain
Latest Technical Papers
- Hardware Design and Security in the Era of Chiplets and LLMs
- DICE: Detailed Inter-Chiplet End-to-End PHY Modeling for Accurate Chiplet Simulation
- APEX: an Adaptive Photonic-Electronic Chiplet Interconnection Architecture for DNN Inference
- Formal Foundations for Known Good Reliable Die Screening in Chiplet-Based AI Systems-on-Chip
- Optimization of Test-Access Architectures and Test Scheduling for 2.5D/3D Integration