By Dr. Moh Kolbehdari, Dir. of Packaging Architecture, Socionext America Inc.
As AI, HPC, and data-centric systems increasingly adopt dense chiplet fabrics, HBM stacks, and high-bandwidth die-to-die interfaces, traditional electrical interconnects face growing challenges related to loss, EMI, routing congestion, power efficiency, and scalability. These constraints increasingly limit system-level performance, yield, and design flexibility.
In this session, Dr. Kolbehdari introduces THz/RF-guided electromagnetic corridors, a new general-purpose in-package fabric that complements electrical links by enabling shared, protocol-agnostic guided-wave paths within silicon interposers, fan-out RDL, and advanced packaging substrates. The approach is designed to integrate into existing manufacturing flows while improving system-level scalability.
