Driving the Future of Automotive Compute with UCIe

As vehicles become increasingly defined by their compute architecture, Advanced Driver-Assistance Systems (ADAS), AI-driven workloads, centralized compute, and zonal vehicle designs are placing new demands on automotive silicon. Meeting these requirements while balancing power efficiency, reliability, functional safety, cost, and long product lifecycles is driving the industry toward more modular and scalable chiplet-based architectures.

Watch the webinar featuring members of the UCIe Consortium's Automotive Working Group, including experts from Cadence and AMD, as they explore how UCIe is enabling next-generation automotive compute platforms through open die-to-die interconnect standards. The discussion highlights how chiplet-based architectures can improve interoperability, scalability, and ecosystem collaboration to address the evolving needs of automotive semiconductor design.

Viewers will also gain insight into the UCIe Consortium's Automotive Working Group and its efforts to advance automotive-specific requirements for interoperability, reliability, and scalable integration as vehicle electronics continue to grow in complexity.

Speakers:

• Bala Chavali, AMD
• Ericles Sousa, Cadence