By Andy Heinig, Group Leader System Integration, Fraunhofer IIS
Andy Heinig is the Technical Leader of the Advanced Packaging Workgroup at the Fraunhofer Institute IIS/EAS, where he works on assembly design kits and design flows for packaging. He has started several major German and European research projects in design and design automation for advanced packaging. He has also worked extensively in several standardization groups such as SI2. Heinig has 55 publications, including presentations at important conferences such as the Electronic Components Technology Conference (ECTC), Electronic Packaging Technology Conference, and the IEEE Conference on Electronics, Circuits, and Systems (ICECS), and in journals such as the IEEE Transactions on Components, Packaging, and Manufacturing Technology. He earned a Diploma degree in information technology from the Technical University of Cottbus (Germany).
