Chiplets Make Progress Using Interconnects As Glue

By Ann Mutschler, SemiEngineering (October 31st, 2024)

Industry learning expands as more SoCs are disaggregated at leading edge, opening door to more third-party chiplets.

Breaking up SoCs into their component parts and putting those and other pieces together in some type of heterogeneous assembly is beginning to take shape, fueled by advances in interconnects, complex partitioning, and industry learnings about what works and what doesn’t.

While the vision of plug-and-play remains intact, getting there is a lot more complicated than initially imagined. It can vary greatly by application and by workload, which in turn can affect timing, latency, and cost. And it can vary by package type, whether AI is included or not, how much software is needed for scheduling and prioritization, and the type of interconnects being used.

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