Chiplets Make Case for More Apps

By Spencer Chin, Design News (February 21, 2024)

AI, high-end computing, and even consumer applications will require the scalability and flexibility of chiplets to meet future packaging needs.

Many chiplet packaging discussions have focused on applications in high-end computing where high density and low latency are needed. But the flexibility and other advantages chiplets offer are also of appeal to makers of complex consumer products, such as AR/VR headsets.

At the recent DesignCon show in Santa Clara, these issues came front and center during a panel session titled, “Chiplets in consumer electronics and infrastructure.” What immediately became obvious was that existing silicon-on-chip technology could no longer scale in a cost-efficient manner for consumer electronics.

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