Chiplets Make Case for More Apps
By Spencer Chin, Design News (February 21, 2024)
AI, high-end computing, and even consumer applications will require the scalability and flexibility of chiplets to meet future packaging needs.
Many chiplet packaging discussions have focused on applications in high-end computing where high density and low latency are needed. But the flexibility and other advantages chiplets offer are also of appeal to makers of complex consumer products, such as AR/VR headsets.
At the recent DesignCon show in Santa Clara, these issues came front and center during a panel session titled, “Chiplets in consumer electronics and infrastructure.” What immediately became obvious was that existing silicon-on-chip technology could no longer scale in a cost-efficient manner for consumer electronics.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Chiplets Make Progress Using Interconnects As Glue
- Chip Architectures Becoming Much More Complex With Chiplets
- Can Chiplets Serve Cost-Conscious Apps?
- Intel moves to chiplets for automotive AI
Latest News
- Sarcina Launches UCIe-A/S Packaging IP to Accelerate Chiplet Architectures
- Ultra Accelerator Link™ (UALink™) Consortium Publishes Four Specifications Defining In-Network Compute, Chiplets, Manageability and 200G Performance
- CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI
- NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments
- Rebellions Closes $400 Million Pre-IPO and Launches RebelRack™ and RebelPOD™ to Accelerate Global Expansion