Multi-Die Systems Set the Stage for Innovation

Abhijeet Chakraborty, Vice President of Engineering at Synopsys, in his keynote at the 2024 Chiplet Summit, said that last year was an inflection point for multi-die systems. Companies, like Synopsys, are providing the tools to design chiplet-based solutions, which is one of the hotter multi-die packaging approaches now available from various fabs.