Machine Learning Applications in EDA for Chiplet Reliability
Learn how AI is transforming chip design and enhancing semiconductor reliability. In this webinar, leading researchers share insights into cutting-edge advancements in the field:
🔹 Dr. George Floros
🔹 Dr. Tahani Aladwani
🔹 Dr. Yixian Shen
🔹 Dr. Olympia Axelou
This webinar was part of COIN3D, a Horizon Europe Twinning project, co-funded by the European Union. It was organized in collaboration with:
🏛️ University of Thessaly
🏛️ University of Amsterdam
🏛️ University of Bremen
🏛️ University of Glasgow
Related Videos
- Chiplet Architecture for Next Gen Infrastructure
- Intel Demonstrates First Fully Integrated Optical I/O Chiplet for More Scalable AI
- Blue Cheetah BlueLynx for Heterogeneous Integration: 16 Gbps Chiplet Interconnect IP for UCIe & BoW
- UCIe 2.0 Specification: Advancing an open ecosystem for on-package chiplet innovation
Latest Videos
- Revolutionizing SoC Design: The Shift to Chiplet-Based Architectures
- Embedded World, Nuremberg: Arm’s Suraj Gajendra on AI, Chiplets, and the Future of Automotive Compute
- Keysight Expands Chiplet Interconnect Support with UCIe 2.0 & BoW
- Revolutionizing AI & Chiplets: Baya Systems CEO on $36M Series B, UALink, Future of Data Movement
- Machine Learning Applications in EDA for Chiplet Reliability