Flexible eFPGA Based Demonstration Platform for Die-to-Die Interface Testing

Achronix and Fraunhofer IIS/EAS jointly presented at the 2024 Chiplet Summit to showcase the collaboration between the two organizations in their presentation titled "Flexible eFPGA Based Demonstration Platform for Die-to-Die Interface Testing." The presentation unveils the advancements in eFPGA technology and its pivotal role in developing die-to-die interfaces, a key component in the evolution of chiplet integration and advanced packaging technologies.

Andy Heinig, Head of the Efficient Electronics Department at Fraunhofer IIS/EAS – Germany's premier applied research institute – and Achronix, a leading manufacturer of high-end FPGAs, present a detailed exploration of a flexible demonstration platform designed to revolutionize die-to-die interface testing. This collaborative effort highlights the synergy between Fraunhofer's expertise in chiplet integration, heat removal, and system implementation and Achronix's innovative Speedster7t FPGAs and eFPGA IP technology.
The presentation begins with an introduction to Fraunhofer's mission in advancing packaging technologies and Achronix's contribution to FPGA development. It then delves into specific use cases emphasizing the necessity for chiplet integration in niche markets such as measurement equipment and automotive, where high-speed data acquisition demands exceed the capabilities of single SoCs.

You will gain insights into the benefits of eFPGA IP technology in achieving heterogeneous integration, enabling flexible, programmable solutions for chiplet die-to-die protocol adaptation. This is further illustrated by exploring UCIe and Bunch of Wire interfaces, showcasing their implementation in high-speed data environments.

Achronix's explanation of FPGA fundamentals provides a solid foundation for understanding the versatility and potential of eFPGA technology. The presentation vividly illustrates how embedded FPGAs serve as a linchpin in system-on-chip (SoC) designs, offering customizable, reprogrammable solutions that adapt to various protocols and application requirements.