2.5 D Heterogeneous Chiplet Packaging Challenge

The topic for today is 2.5 D Heterogeneous ‘Chiplet’ Packaging Challenge. We have with us Mr Vern Solberg, Technology Expert to discuss the same.

PROFILE OF GUEST:

Vern Solberg is an accomplished author and educator with over four decades of experience in surface mount, microelectronic design, and manufacturing technology. Proudly recognized by esteemed organizations like the SMTA and IPC Standards Organization for his work in establishing industry standards for surface mount technology. Acting as chairman and co-chair, Solberg played a pivotal role in developing the IPC-7900 series of design and process implementation standards for BGA, FBGA, Embedded Component, and 3D Microelectronic Package Technologies. His expertise and leadership helped shape the way electronic products are designed and manufactured, ensuring efficiency and reliability in the production process. Based in the heart of California’s Silicon Valley, Vern has dedicated his career to developing electronic products that prioritize efficiency and reliability. As a design engineer for a leading semiconductor package development company, he has honed his expertise in creating cutting- edge solutions for the tech industry.