Chiplets for Automotive: Scalable Compute with Next-Gen Packaging
By Stewart Bell, Socionext
Chiplets are transforming the future of automotive compute platforms – offering greater scalability, flexibility, and performance than ever before. Overcoming Design, Test and Fabrication Challenges
In this session, Socionext’s Director Solution SoC / Data Center and Networking, Stewart Bell, will explore how chiplets can solve the challenges of modern ADAS and automotive SoC design, enabling a modular approach to high-performance computing.
Key topics covered:
- What chiplets are and how they differ from traditional monolithic SoCs
- Disaggregation and aggregation – the two driving forces behind chiplet adoption
- Benefits of homogeneous and heterogeneous chiplet integration
- Advanced 2.5D and 3D packaging: Enabling high-speed die-to-die communication
- Real-world design and manufacturing challenges – and how Socionext addresses them
- Insights into testing, validation, and quality control in a chiplet-based world
- Collaborations with Arm, TSMC, and key industry groups to build open, standardised ecosystems
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- Automotive AI Accelerator
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