Chiplets for Automotive: Scalable Compute with Next-Gen Packaging

By Stewart Bell, Socionext

Chiplets are transforming the future of automotive compute platforms – offering greater scalability, flexibility, and performance than ever before. Overcoming Design, Test and Fabrication Challenges

In this session, Socionext’s Director Solution SoC / Data Center and Networking, Stewart Bell, will explore how chiplets can solve the challenges of modern ADAS and automotive SoC design, enabling a modular approach to high-performance computing.

Key topics covered:

•   What chiplets are and how they differ from traditional monolithic SoCs
•   Disaggregation and aggregation – the two driving forces behind chiplet adoption
•   Benefits of homogeneous and heterogeneous chiplet integration
•   Advanced 2.5D and 3D packaging: Enabling high-speed die-to-die communication
•   Real-world design and manufacturing challenges – and how Socionext addresses them
•   Insights into testing, validation, and quality control in a chiplet-based world
•   Collaborations with Arm, TSMC, and key industry groups to build open, standardised ecosystems