Chiplets for Automotive: Scalable Compute with Next-Gen Packaging

By Stewart Bell, Socionext

Chiplets are transforming the future of automotive compute platforms – offering greater scalability, flexibility, and performance than ever before. Overcoming Design, Test and Fabrication Challenges

In this session, Socionext’s Director Solution SoC / Data Center and Networking, Stewart Bell, will explore how chiplets can solve the challenges of modern ADAS and automotive SoC design, enabling a modular approach to high-performance computing.

Key topics covered:

  •   What chiplets are and how they differ from traditional monolithic SoCs
  •   Disaggregation and aggregation – the two driving forces behind chiplet adoption
  •   Benefits of homogeneous and heterogeneous chiplet integration
  •   Advanced 2.5D and 3D packaging: Enabling high-speed die-to-die communication
  •   Real-world design and manufacturing challenges – and how Socionext addresses them
  •   Insights into testing, validation, and quality control in a chiplet-based world
  •   Collaborations with Arm, TSMC, and key industry groups to build open, standardised ecosystems