Chiplets and Next-gen Packaging Technologies in University Education
Jajaie Anda; Puscasu Alexandru; Ailenei Ioana; Ciobanu Catalin; Svasta Paul, National University of Science and Technology POLITEHNICA of Bucharest, Romania , Transilvania University of Brasov, Romania
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related Videos
- GENIOEVO™ – Architectural Exploration and Connectivity Management in Advanced Packaging
- Paving the Road Ahead: RISC-V and Chiplet Technologies in Modern Automotive and Data Center Architectures
- Chiplets in 2029 and How We Got There
- Surface codes and modular chiplets in the presence of defects
Latest Videos
- 2026 DRAM and Advanced Packaging Master Class
- Chiplets, RISC-V, and Europe's AI Silicon Ambition
- Driving the Future of Automotive Compute with UCIe
- A Physics-Informed Neural Network Surrogate for Runtime PDN and Dynamic Droop Prediction in 2.5-D Chiplet Integration
- A Chiplet Interface Model for System-Level PPA Exploration