Chiplets and Next-gen Packaging Technologies in University Education
Jajaie Anda; Puscasu Alexandru; Ailenei Ioana; Ciobanu Catalin; Svasta Paul, National University of Science and Technology POLITEHNICA of Bucharest, Romania , Transilvania University of Brasov, Romania
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- GENIOEVO™ – Architectural Exploration and Connectivity Management in Advanced Packaging
- Paving the Road Ahead: RISC-V and Chiplet Technologies in Modern Automotive and Data Center Architectures
- Chiplets in 2029 and How We Got There
- Surface codes and modular chiplets in the presence of defects
Latest Videos
- 2026 Predictions from Alpahwave Semi, now part of Qualcomm
- Arm Viewpoints: Chiplets explained – the technology and economics behind the next wave of silicon innovation
- The State of Multi-Die: Insights and Customer Requirements
- Coding approaches for increasing reliability and energy efficiency of 3D technologies
- AI-Driven Thermal Prediction for Enhanced Reliability in 3D HBM Chiplets