Synopsys Keynote at Chiplet Summit 2025: Accelerating AI Chip Development with 3D Multi-Die Designs
Abhijeet Chakraborty, VP Engineering at Synopsys, presented one of the keynotes at the 2025 Chiplet Summit. He talks about essential multi-die innovations need to build the latest artificial intelligence (AI) chips. He also touches on the necessary lifecycle management needs of developers
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