An Automated Interconnect Modeling Framework for Rapid Cryptolet Design Space Exploration
By Prof. Austin Rovinski (NYU)
State-of-the-art cryptographic hardware accelerators often require a huge amount of silicon area - sometimes even above the limit of what can fit onto a single chip. These accelerators motivate a shift to designing chiplet-based systems, where multiple chips are tightly integrated onto the same package instead of one large chip. However, chiplets also raise many new design constraints and tradeoffs in terms of packaging options, interconnect bandwidth, power, cost, and more. In this talk, I will present my group's recent work on developing an automated interconnect modeling framework which dramatically simplifies the process of modeling chiplet interconnects, and how it can be used to enable rapid, system-level design space exploration for cryptographic chiplet systems (cryptolets). I will also provide a sneak-peek demo of the framework before its open-source release next month.
Related Chiplet
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
Related Videos
- Blue Cheetah BlueLynx for Heterogeneous Integration: 16 Gbps Chiplet Interconnect IP for UCIe & BoW
- RapidChiplet: How to Explore the Design Space of Inter-Chiplet Interconnects
- Multi-Die Systems Set the Stage for Innovation
- Paving the way for the Chiplet Ecosystem
Latest Videos
- A Chiplet Interface Model for System-Level PPA Exploration
- Zero trust in silicon: The new security imperative for chiplet-based 3D ICs
- Beyond the data pipe: Why connectivity IP is now the system-critical layer in every 3D IC
- An Automated Interconnect Modeling Framework for Rapid Cryptolet Design Space Exploration
- DICE: Detailed Inter-Chiplet End-to-End PHY Modeling for Accurate Chiplet Simulation