An Automated Interconnect Modeling Framework for Rapid Cryptolet Design Space Exploration
By Prof. Austin Rovinski (NYU)
State-of-the-art cryptographic hardware accelerators often require a huge amount of silicon area - sometimes even above the limit of what can fit onto a single chip. These accelerators motivate a shift to designing chiplet-based systems, where multiple chips are tightly integrated onto the same package instead of one large chip. However, chiplets also raise many new design constraints and tradeoffs in terms of packaging options, interconnect bandwidth, power, cost, and more. In this talk, I will present my group's recent work on developing an automated interconnect modeling framework which dramatically simplifies the process of modeling chiplet interconnects, and how it can be used to enable rapid, system-level design space exploration for cryptographic chiplet systems (cryptolets). I will also provide a sneak-peek demo of the framework before its open-source release next month.
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related Videos
- Blue Cheetah BlueLynx for Heterogeneous Integration: 16 Gbps Chiplet Interconnect IP for UCIe & BoW
- RapidChiplet: How to Explore the Design Space of Inter-Chiplet Interconnects
- Multi-Die Systems Set the Stage for Innovation
- Paving the way for the Chiplet Ecosystem
Latest Videos
- From chips to silicon destiny: The next wave of 3D IC
- How Chiplets are Helping to Democratize Semiconductor Design with Mohit Gupta, CEO of TYLsemi
- The Future of 3D Heterogeneous Integration (3DHI)
- Stop Guessing on Multi-Die PG Planning: Let AI Find the IR-Drop Sweet Spot
- Arm's Dong Wei on Why Firmware Will Define the Chiplet Ecosystem