Driving AI Innovation with Chiplet Standards
How are chiplet standards evolving to enable an open ecosystem? Jawad Nasrullah, CEO from Palo Alto Electron and Open Chiplet Economy Sub-Project Co-Lead for Open Compute Project, explains:
- Die-to-die communication standards like Bunch of Wires (BOW) are laying the foundation for modern chiplet interconnect specifications
- New standardized design languages like CCDXML enable cross-vendor tool compatibility for chiplet integration
- Development of chiplet socket standards addresses power delivery, bump maps, and mechanical specifications for large-scale systems
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
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