A Deep Dive into UCIe-3D
With increasing demands for higher performance, bandwidth density, and power efficiency the industry is rapidly adopting 2.5D and 3D packaging technologies to address these challenges. This shift highlights the pressing need for a unified industry ecosystem standard—one that provides a standardized architecture for streamlined manageability and addresses the unique design complexities of advanced packaging. The UCIe 2.0 specification supports 3D packaging – offering higher bandwidth density and improved power efficiency compared to 2D and 2.5D architectures.
Join us in this webinar as we dive into the benefits of UCIe-3D including its hybrid bonding optimization, flexible bump pitch adaptability, and the scalability needed to drive the next wave of chiplet and packaging innovations.
Presenter:
Zuoguo (Joe) Wu, UCIe Consortium Electrical Working Group Co-Chair and Sr Principal Engineer at Intel
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