What's a Chiplet ? Why Now ?
The Ojo-Yoshida Report began a five-episode videocast, “Dig Deeper on Chiplets,” in November.
One more episode (“China Goes for Chiplets") remains to go on air. In the meantime, however, to help our audience catch up, we held a wrap-up session with the series’ host Ron Wilson, our Technology Editor.
The promise of chiplets has taken the industry by storm. But as we have maintained, a host of technical challenges remains, with serious questions about how the emerging ecosystem around 2.5D and 3D integration might disaggregate the semiconductor industry landscape as we know it. Is this a threat or an opportunity?
Based on the video interviews in our five "Dig Deeper" episodes, Junko Yoshida and Bolaji Ojo join Ron Wilson, to compare notes, discuss what we’ve learned, and look forward to learning more in our upcoming 2024 Season Two.
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related Videos
- Rethinking chip(let) design for next generation ADAS applications
- On Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low-Power, High-Bandwith, Low-Latency and Low-Cost Approach
- Splitting the Die A Modular Approach to Chiplet Design and Verification
- A Chiplet Interface Model for System-Level PPA Exploration
Latest Videos
- 2026 DRAM and Advanced Packaging Master Class
- Chiplets, RISC-V, and Europe's AI Silicon Ambition
- Driving the Future of Automotive Compute with UCIe
- A Physics-Informed Neural Network Surrogate for Runtime PDN and Dynamic Droop Prediction in 2.5-D Chiplet Integration
- A Chiplet Interface Model for System-Level PPA Exploration