What's a Chiplet ? Why Now ?
The Ojo-Yoshida Report began a five-episode videocast, “Dig Deeper on Chiplets,” in November.
One more episode (“China Goes for Chiplets") remains to go on air. In the meantime, however, to help our audience catch up, we held a wrap-up session with the series’ host Ron Wilson, our Technology Editor.
The promise of chiplets has taken the industry by storm. But as we have maintained, a host of technical challenges remains, with serious questions about how the emerging ecosystem around 2.5D and 3D integration might disaggregate the semiconductor industry landscape as we know it. Is this a threat or an opportunity?
Based on the video interviews in our five "Dig Deeper" episodes, Junko Yoshida and Bolaji Ojo join Ron Wilson, to compare notes, discuss what we’ve learned, and look forward to learning more in our upcoming 2024 Season Two.
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related Videos
- On Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low-Power, High-Bandwith, Low-Latency and Low-Cost Approach
- Splitting the Die A Modular Approach to Chiplet Design and Verification
- A Chiplet Interface Model for System-Level PPA Exploration
- A Physics-Informed Neural Network Surrogate for Runtime PDN and Dynamic Droop Prediction in 2.5-D Chiplet Integration
Latest Videos
- Accelerating Chiplet SoC Development with Standards-Based Frameworks and Automated Design Flows
- Qualcomm's Tony Pialis on Dragonfly and the Data Movement Wall
- From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands
- Advancing 3DIC Technologies to Propel AI Innovations
- Building Real Confidence in Chiplet Stacks with Evelyn Landman of proteanTecs