Ayar Labs Expands 2026 Funding to $650 Million to Scale Manufacturing-Ready CPO for AI Scale-Up Beyond the Rack 2026-09-10 13:24:10
Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion 2026-09-09 05:47:11
onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era 2026-09-17 15:25:00 Interconnects & Integration
GlobalFoundries and Marvell expand collaboration for next-generation optical connectivity 2026-09-17 13:17:07 Business & Deals
NewPhotonics® and Tower Semiconductor Begin High-Volume Shipments of Laser-Integrated, Serviceable Optical Engine PICs for Scale-Out and Scale Up AI Interconnect 2026-09-17 11:19:54 Manufacturing & Supply Chain
Avicena to Demonstrate World’s First Connectorized microLED Optical Interconnect for AI Infrastructure at ECOC 2026 2026-09-17 10:19:00 Interconnects & Integration
Delos Data Closes over $100 Million to Deliver Delos Nonstop AI™ for Faster, Stronger, More Efficient AI Capacity 2026-09-17 07:52:00 Business & Deals
Delos Data Unveils Nonstop AI™ to Build and Scale Resilient AI Clusters to Deliver Nonstop Tokens 2026-09-17 07:49:00 Interconnects & Integration
Micas Networks Expands Company-Operated Manufacturing to Scale Commercial CPO 2026-09-16 13:37:39 Manufacturing & Supply Chain
Polaris Electro-Optics Secures $50M Series B to Scale Next-Gen Optical Engine Platform for AI Infrastructure 2026-09-16 05:51:00 Business & Deals
Arteris Accelerates Industry Transition to Multi-Die Chiplet-Based Architecture 2026-09-15 13:18:00 Chiplet-Ready IP
Fujitsu launches made-in-Japan next-generation CPU FUJITSU-MONAKA and Fujitsu MONAKA Server for sovereign AI infrastructure 2026-09-15 06:47:22 Chiplet-Based Chips
Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem 2026-09-15 06:17:41 Ecosystem & Strategy
Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP 2026-09-14 18:38:24 Design, Tools & Validation
Alchip Technologies Showcases Advanced ASIC Design and Packaging at AI Infra Summit 2026 2026-09-14 14:46:48 Misc
NcodiN Appoints Carlo Guareschi as Chief Business Officer, Yacine Halioua as Chief Product Officer, and Zachary Cho as General Manager, France 2026-09-14 11:23:00 Misc
Chiplet-Based FPGAs Optimize Performance for Space Applications 2026-09-10 18:44:00 Analysis & Commentary
Ayar Labs Expands 2026 Funding to $650 Million to Scale Manufacturing-Ready CPO for AI Scale-Up Beyond the Rack 2026-09-10 13:24:10 Business & Deals
From pilot line to industrial implementation: FIRST by FMD brings together decision-makers for Europe’s semiconductor future 2026-09-10 11:33:00 Ecosystem & Strategy
Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion 2026-09-09 05:47:11 Manufacturing & Supply Chain
HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor Ecosystem 2026-09-08 14:42:05 Business & Deals
EdgeCortix Signs Multi-Year, Multimillion-Dollar Agreement with Kawasaki Heavy Industries to Advance Next-Generation AI-Enabled Aerial Defense Systems 2026-09-08 07:40:00 Business & Deals