Point2 Completes $136M Series B Funding with Arm, LB Investment, and Maverick Silicon
2026-08-11 05:42:00
Ecosystem Highlights
Recent Updates
Point2 Completes $136M Series B Funding with Arm, LB Investment, and Maverick Silicon
2026-08-11 05:42:00
Business & Deals
Multibeam Appoints Interim CFO Following $200M Funding Milestone
2026-08-10 15:40:26
Other
Multibeam Signs $140 Million Letter of Intent with the U.S. Department of Commerce
2026-08-10 15:30:00
Business & Deals
Credo to Contribute OmniConnect Scale-In Interconnect Solution to the Open Compute Project to Address AI Inference Memory Wall
2026-08-10 13:06:00
Standards & Research
Silicon Box Ships 500M Units at High Yield, Expands Production Capacity for Panel-Level Packaging
2026-08-09 04:22:36
Manufacturing & Supply Chain
GlobalFoundries’ Growth Makes the Case for a U.S. Photonics Buildout
2026-08-07 07:15:51
Analysis & Commentary
China Accounts for 56% of Global Optical Module Manufacturing; Short-Term Supply Chain Decoupling Unlikely Under Potential U.S. Restrictions
2026-08-05 12:38:18
Analysis & Commentary
Socionext Joins imec's Autonomous Edge Chiplet Program (AECP)
2026-08-03 19:18:12
Ecosystem & Strategy
CEA-Leti Pushes Stacking Roadmap as AI Runs Into Memory and Power Limits
2026-07-31 16:48:52
Analysis & Commentary
Department of Commerce Announces Letters of Intent With 7 Companies for $874 Million to Accelerate Semiconductor R&D for the Compute Supply Chain
2026-07-30 06:52:03
Manufacturing & Supply Chain
Micross to Acquire AEMtec, Significantly Expanding European Footprint in Advanced Packaging and Optoelectronics
2026-07-30 05:54:54
Business & Deals
Eliyan Achieves Unicorn Status with $145 Million Series C to Advance Electro-optical Interconnects for AI Infrastructure
2026-07-29 15:20:52
Business & Deals
GlobalFoundries signs letter of intent with the U.S. Department of Commerce for a $300 million award to accelerate U.S. silicon photonics leadership
2026-07-29 11:34:02
Manufacturing & Supply Chain
Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap
2026-07-29 11:15:11
Manufacturing & Supply Chain
Multibeam Secures First Taiwan Order for Newly Launched MBX Platform – The Company’s Second Generation Multi-Column E-Beam Lithography System
2026-07-29 09:11:47
Design, Tools & Validation
From Co-Packaged Optics to Nanolasers: Photonics Moves Inward
2026-07-29 08:36:00
Analysis & Commentary
NVIDIA and Broadcom Begin Volume Ramp of CPO Switches, with Optical Engine Yield and Advanced Packaging Capacity Emerging as Key Expansion Bottlenecks
2026-07-29 08:10:17
Analysis & Commentary
Tessolve and Intel Foundry Collaborate on Enablement for EMIB Advanced Packaging Technology
2026-07-28 06:20:51
Design, Tools & Validation
Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era
2026-07-27 06:25:04
Business & Deals
Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure
2026-07-24 05:14:04
Business & Deals
Point2 Completes $136M Series B Funding with Arm, LB Investment, and Maverick Silicon
2026-08-11 05:42:00
Business & Deals
Multibeam Appoints Interim CFO Following $200M Funding Milestone
2026-08-10 15:40:26
Other
Multibeam Signs $140 Million Letter of Intent with the U.S. Department of Commerce
2026-08-10 15:30:00
Business & Deals
Credo to Contribute OmniConnect Scale-In Interconnect Solution to the Open Compute Project to Address AI Inference Memory Wall
2026-08-10 13:06:00
Standards & Research
Silicon Box Ships 500M Units at High Yield, Expands Production Capacity for Panel-Level Packaging
2026-08-09 04:22:36
Manufacturing & Supply Chain
GlobalFoundries’ Growth Makes the Case for a U.S. Photonics Buildout
2026-08-07 07:15:51
Analysis & Commentary
China Accounts for 56% of Global Optical Module Manufacturing; Short-Term Supply Chain Decoupling Unlikely Under Potential U.S. Restrictions
2026-08-05 12:38:18
Analysis & Commentary
Socionext Joins imec's Autonomous Edge Chiplet Program (AECP)
2026-08-03 19:18:12
Ecosystem & Strategy
CEA-Leti Pushes Stacking Roadmap as AI Runs Into Memory and Power Limits
2026-07-31 16:48:52
Analysis & Commentary
Department of Commerce Announces Letters of Intent With 7 Companies for $874 Million to Accelerate Semiconductor R&D for the Compute Supply Chain
2026-07-30 06:52:03
Manufacturing & Supply Chain
Micross to Acquire AEMtec, Significantly Expanding European Footprint in Advanced Packaging and Optoelectronics
2026-07-30 05:54:54
Business & Deals
Eliyan Achieves Unicorn Status with $145 Million Series C to Advance Electro-optical Interconnects for AI Infrastructure
2026-07-29 15:20:52
Business & Deals
GlobalFoundries signs letter of intent with the U.S. Department of Commerce for a $300 million award to accelerate U.S. silicon photonics leadership
2026-07-29 11:34:02
Manufacturing & Supply Chain
Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap
2026-07-29 11:15:11
Manufacturing & Supply Chain
Multibeam Secures First Taiwan Order for Newly Launched MBX Platform – The Company’s Second Generation Multi-Column E-Beam Lithography System
2026-07-29 09:11:47
Design, Tools & Validation
From Co-Packaged Optics to Nanolasers: Photonics Moves Inward
2026-07-29 08:36:00
Analysis & Commentary
NVIDIA and Broadcom Begin Volume Ramp of CPO Switches, with Optical Engine Yield and Advanced Packaging Capacity Emerging as Key Expansion Bottlenecks
2026-07-29 08:10:17
Analysis & Commentary
Tessolve and Intel Foundry Collaborate on Enablement for EMIB Advanced Packaging Technology
2026-07-28 06:20:51
Design, Tools & Validation
Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era
2026-07-27 06:25:04
Business & Deals
Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure
2026-07-24 05:14:04
Business & Deals