Socionext Expands 3DIC Support with Advanced 3D Die Stacking and 5.5D in Packaging Portfolio
2025-09-01 09:14:00
Chiplet
Recent News
Rebellions Debuts REBEL-Quad at Hot Chips 2025, breaking AI’s Energy Tax with High-Performance Chiplet Innovation
2025-09-01 06:11:00
Chiplet-Based Chip
Celestial AI Introduces Photonic Fabric™ Module - World’s First SoC with In-Die Optical Interconnect, Ushering in a New Era of Interconnects
2025-08-29 13:28:00
Photonics
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
2025-08-29 05:33:00
Advanced Packaging
Arteris Joins UALink Consortium to Accelerate High-Performance AI Networks Scale Up
2025-08-28 11:33:00
Standards
Athos Silicon Chief mSoC™ Architect Francois Piednoel to Present the IEEE World Technology Summit 2025 in Berlin
2025-08-27 06:37:00
Event
Marvell Unveils Industry’s First 64 Gbps/wire Bi-Directional Die-to-Die Interface IP in 2nm to Power Next Generation XPUs
2025-08-26 13:25:00
IP
Xscape Photonics and Tower Semiconductor Unveil the Industry’s First Optically Pumped On-Chip Multi-Wavelength Laser Platform for AI Datacenter Fabrics
2025-08-25 11:34:00
Photonics
Electrical Engineering and Computer Science Department Chair Alex K. Jones and Professor Bryan Kim Receive NSF Grant to Develop Energy-Efficient Chiplets for Data Centers
2025-08-25 05:50:00
Research & Development
NHanced Semiconductors & University of Florida to Present Chiplet Paper at 36th Electronics Packaging Symposium
2025-08-20 03:20:00
Other
Silicon 100: Chiplet work spanning interconnect PHYs to smart substrates
2025-08-18 12:29:00
Commentary / Analysis
Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology
2025-08-15 05:49:00
Business
ASICLAND Initiates Two Chiplet SoC Development Contracts with Primemas Worth a Total of KRW 16 Billion
2025-08-15 04:19:00
Business
OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
2025-08-14 05:47:00
Foundries
Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA
2025-08-13 13:13:00
EDA
Celestial AI Closes Final Series C1 Round to Accelerate Next-Generation AI Computing
2025-08-13 12:58:00
Business
Rigetti Computing Reports Second Quarter 2025 Financial Results; Announces General Availability of its 36-Qubit Multi-Chip Quantum Computer
2025-08-13 08:43:00
Business
AMI Launches Developer Program for Arm Total Design to Rapidly Accelerate Arm-based Chiplet Development
2025-08-12 15:12:00
Other
Wave Photonics launches its PDK Management Platform with CORNERSTONE as the first user
2025-08-12 13:14:00
EDA
Chiplet Interfaces Embrace Failures
2025-08-12 08:30:00
Commentary / Analysis
Rebellions Debuts REBEL-Quad at Hot Chips 2025, breaking AI’s Energy Tax with High-Performance Chiplet Innovation
2025-09-01 06:11:00
Chiplet-Based Chip
Celestial AI Introduces Photonic Fabric™ Module - World’s First SoC with In-Die Optical Interconnect, Ushering in a New Era of Interconnects
2025-08-29 13:28:00
Photonics
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
2025-08-29 05:33:00
Advanced Packaging
Arteris Joins UALink Consortium to Accelerate High-Performance AI Networks Scale Up
2025-08-28 11:33:00
Standards
Athos Silicon Chief mSoC™ Architect Francois Piednoel to Present the IEEE World Technology Summit 2025 in Berlin
2025-08-27 06:37:00
Event
Marvell Unveils Industry’s First 64 Gbps/wire Bi-Directional Die-to-Die Interface IP in 2nm to Power Next Generation XPUs
2025-08-26 13:25:00
IP
Xscape Photonics and Tower Semiconductor Unveil the Industry’s First Optically Pumped On-Chip Multi-Wavelength Laser Platform for AI Datacenter Fabrics
2025-08-25 11:34:00
Photonics
Electrical Engineering and Computer Science Department Chair Alex K. Jones and Professor Bryan Kim Receive NSF Grant to Develop Energy-Efficient Chiplets for Data Centers
2025-08-25 05:50:00
Research & Development
NHanced Semiconductors & University of Florida to Present Chiplet Paper at 36th Electronics Packaging Symposium
2025-08-20 03:20:00
Other
Silicon 100: Chiplet work spanning interconnect PHYs to smart substrates
2025-08-18 12:29:00
Commentary / Analysis
Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology
2025-08-15 05:49:00
Business
ASICLAND Initiates Two Chiplet SoC Development Contracts with Primemas Worth a Total of KRW 16 Billion
2025-08-15 04:19:00
Business
OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
2025-08-14 05:47:00
Foundries
Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA
2025-08-13 13:13:00
EDA
Celestial AI Closes Final Series C1 Round to Accelerate Next-Generation AI Computing
2025-08-13 12:58:00
Business
Rigetti Computing Reports Second Quarter 2025 Financial Results; Announces General Availability of its 36-Qubit Multi-Chip Quantum Computer
2025-08-13 08:43:00
Business
AMI Launches Developer Program for Arm Total Design to Rapidly Accelerate Arm-based Chiplet Development
2025-08-12 15:12:00
Other
Wave Photonics launches its PDK Management Platform with CORNERSTONE as the first user
2025-08-12 13:14:00
EDA
Chiplet Interfaces Embrace Failures
2025-08-12 08:30:00
Commentary / Analysis