Ranovus® announces collaboration with Jabil® for mass production of ODIN® optical engine 2025-03-31 14:32:00 Photonics
Ayar Labs Unveils World's First UCIe Optical Chiplet for AI Scale-Up Architectures 2025-03-31 14:04:00 Chiplet
Avicena Announces Modular LightBundle™ Optical Interconnect Platform with > 1Tbps/mm I/O density and < 1pJ/bit 2025-03-31 12:53:00 Interconnect
NHanced Semiconductors President Robert Patti to Detail “Foundry 2.0” at SEMIEXPO Heartland 2025-03-31 06:43:00 Event
HyperLight Launches TFLN Chiplet™ Platform with Scalable 6-Inch Production and 8-Inch Expansion for Next-Gen AI and Photonics Infrastructure 2025-03-27 18:38:00 Chiplet
Global Fab Equipment Investment Expected to Reach $110 Billion in 2025 2025-03-26 14:37:00 Commentary / Analysis
X-FAB, SMART Photonics and Epiphany Design demonstrate InP-on-Silicon design flow for next-generation optical transceivers at OFC 2025-03-26 11:33:00 Foundries
Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions 2025-03-26 07:37:00 Advanced Packaging
HyperLight Launches 110GHz Intensity Modulator with Record low Vπ, Leveraging Its TFLN Chiplet™ Platform 2025-03-25 20:03:00 Chiplet
OFC 2025: Scintil Photonics showcases LEAF Light™, world’s first single-chip, multi-wavelength laser source for DWDM co-packaged optics in AI datacenters 2025-03-25 17:35:00 Photonics
Lightmatter Welcomes Industry Leader Jason Zander to Its Board of Directors 2025-03-25 17:27:00 People
Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market 2025-03-25 14:31:00 Other
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions 2025-03-24 13:58:00 EDA
Keysight Launches Comprehensive Solution for Accurate and Seamless Photonic Circuit Design 2025-03-19 20:44:00 EDA
EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI® Automated Production Wafer Bonding System 2025-03-19 16:19:00 Equipment