Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap
WILMINGTON, Del. -- July 29, 2026 -- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced it is accelerating investments in next-generation technologies through access to a broad portfolio of research programs.
As AI workloads, high-performance computing, and data-intensive applications demand more performance and efficiency, chipmakers are increasingly turning to chiplets, high-bandwidth memory, wafer-level packaging, 3D stacking, and heterogeneous integration — a shift from two-dimensional designs to more complex vertical architectures. Qnity is investing ahead of this transition with a differentiated platform that spans the full packaging ecosystem from front end to back end, including materials for patterning, planarization, metallization and interconnect technologies, advanced packaging solutions, and thermal management.
In the context of this investment, Qnity has joined hands with imec, the world-leading research and innovation center for advanced semiconductor technologies. As a member of its research program, Qnity gains deeper access to imec’s broad portfolio of research programs, world-class infrastructure and experts, and global ecosystem of industry and academic partners. The partnership is aligned with Qnity’s longer-horizon innovation agenda that will enable the next leap in computing, and strengthens the company’s ability to co-develop and accelerate next-generation materials innovation alongside the world’s technology leaders.
“Qnity is investing where the industry is going next,” said Randy King, Chief Technology Officer at Qnity. “As computing moves toward shrink and stack, advanced packaging is becoming one of the most critical frontiers for performance, efficiency and scale. Our collaboration with imec gives us deeper access to the ecosystem, infrastructure, experts, and partnerships needed to help shape that future, bringing next-generation materials innovation to our customers.”
Learn more about how Qnity is powering the next leap forward at qnityelectronics.com.
About Qnity
Qnity™ is a premier technology provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- Advanced IC Packaging: The Roadmap to 3D IC Semiconductor Scaling
- Diamond Quanta Announces Adamantine Thermal™, Extending Its Advanced Packaging Roadmap Following CES 2026
- Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications
- Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
Latest News
- Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions
- proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die Systems
- JCET Advances High-Aspect-Ratio TSV Technology for 2.5D and 3D Packaging
- Semiconductor Research Corporation Launches SPARC, Accelerating Industry-Driven University Research for the Next Generation of Semiconductor Innovation
- The world’s first technology 'Silicon Motherboard' Circuits are formed on both sides of the silicon substrate, reducing mounting footprint by 80%