Ayar Labs Unveils World's First UCIe Optical Chiplet for AI Scale-Up Architectures
2025-03-31 12:04:00
Chiplet
Recent News
Avicena Announces Modular LightBundle™ Optical Interconnect Platform with > 1Tbps/mm I/O density and < 1pJ/bit
2025-03-31 10:53:00
Interconnect
NHanced Semiconductors President Robert Patti to Detail “Foundry 2.0” at SEMIEXPO Heartland
2025-03-31 04:43:00
Event
HyperLight Launches TFLN Chiplet™ Platform with Scalable 6-Inch Production and 8-Inch Expansion for Next-Gen AI and Photonics Infrastructure
2025-03-27 17:38:00
Chiplet
Intel’s Embarrassment of Riches: Advanced Packaging
2025-03-27 13:53:00
Commentary / Analysis
Challenges In Managing Chiplet Resources
2025-03-27 07:48:00
Commentary / Analysis
Global Fab Equipment Investment Expected to Reach $110 Billion in 2025
2025-03-26 13:37:00
Commentary / Analysis
X-FAB, SMART Photonics and Epiphany Design demonstrate InP-on-Silicon design flow for next-generation optical transceivers at OFC
2025-03-26 10:33:00
Foundries
Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
2025-03-26 06:37:00
Advanced Packaging
HyperLight Launches 110GHz Intensity Modulator with Record low Vπ, Leveraging Its TFLN Chiplet™ Platform
2025-03-25 19:03:00
Chiplet
OFC 2025: Scintil Photonics showcases LEAF Light™, world’s first single-chip, multi-wavelength laser source for DWDM co-packaged optics in AI datacenters
2025-03-25 16:35:00
Photonics
Lightmatter Welcomes Industry Leader Jason Zander to Its Board of Directors
2025-03-25 16:27:00
People
Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
2025-03-25 13:31:00
Other
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions
2025-03-24 12:58:00
EDA
Big Changes Ahead For Interposers And Substrates
2025-03-24 12:25:00
Commentary / Analysis
SoCs Get a Helping Hand from AI Platform FlexGen
2025-03-21 16:17:00
Commentary / Analysis
What Exactly Are Chiplets And Heterogeneous Integration?
2025-03-20 08:20:00
Commentary / Analysis
Keysight Launches Comprehensive Solution for Accurate and Seamless Photonic Circuit Design
2025-03-19 19:44:00
EDA
EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI® Automated Production Wafer Bonding System
2025-03-19 15:19:00
Equipment
Chiplets Add New Power Issues
2025-03-13 11:55:00
Commentary / Analysis
Avicena Announces Modular LightBundle™ Optical Interconnect Platform with > 1Tbps/mm I/O density and < 1pJ/bit
2025-03-31 10:53:00
Interconnect
NHanced Semiconductors President Robert Patti to Detail “Foundry 2.0” at SEMIEXPO Heartland
2025-03-31 04:43:00
Event
HyperLight Launches TFLN Chiplet™ Platform with Scalable 6-Inch Production and 8-Inch Expansion for Next-Gen AI and Photonics Infrastructure
2025-03-27 17:38:00
Chiplet
Intel’s Embarrassment of Riches: Advanced Packaging
2025-03-27 13:53:00
Commentary / Analysis
Challenges In Managing Chiplet Resources
2025-03-27 07:48:00
Commentary / Analysis
Global Fab Equipment Investment Expected to Reach $110 Billion in 2025
2025-03-26 13:37:00
Commentary / Analysis
X-FAB, SMART Photonics and Epiphany Design demonstrate InP-on-Silicon design flow for next-generation optical transceivers at OFC
2025-03-26 10:33:00
Foundries
Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
2025-03-26 06:37:00
Advanced Packaging
HyperLight Launches 110GHz Intensity Modulator with Record low Vπ, Leveraging Its TFLN Chiplet™ Platform
2025-03-25 19:03:00
Chiplet
OFC 2025: Scintil Photonics showcases LEAF Light™, world’s first single-chip, multi-wavelength laser source for DWDM co-packaged optics in AI datacenters
2025-03-25 16:35:00
Photonics
Lightmatter Welcomes Industry Leader Jason Zander to Its Board of Directors
2025-03-25 16:27:00
People
Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
2025-03-25 13:31:00
Other
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions
2025-03-24 12:58:00
EDA
Big Changes Ahead For Interposers And Substrates
2025-03-24 12:25:00
Commentary / Analysis
SoCs Get a Helping Hand from AI Platform FlexGen
2025-03-21 16:17:00
Commentary / Analysis
What Exactly Are Chiplets And Heterogeneous Integration?
2025-03-20 08:20:00
Commentary / Analysis
Keysight Launches Comprehensive Solution for Accurate and Seamless Photonic Circuit Design
2025-03-19 19:44:00
EDA
EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI® Automated Production Wafer Bonding System
2025-03-19 15:19:00
Equipment
Chiplets Add New Power Issues
2025-03-13 11:55:00
Commentary / Analysis