3Dblox
3Dblox is an open industry standard language and format used in the semiconductor industry to describe and design 3D integrated circuits (3D ICs) — especially complex multi-chip packages and chiplet-based systems.
Related Blogs
- Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
- Addressing Stress In Heterogeneous 3D-IC Designs
- Advancing 3D IC Design for AI Innovation
Related News
- Siemens and ASE collaborate on Innovator3D IC driven 3Dblox workflows for ASE’s VIPack platform
- Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows
- Zero ASIC releases PackageCompiler, the world’s first fully autonomous chip package compiler.
- Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies
Featured Content
- Micas Networks Expands Company-Operated Manufacturing to Scale Commercial CPO
- SoC and NoC in the Chiplet Era: Understanding Modern SoC Architecture
- Chiplet Identity and Roots of Trust in FCSA Systems: An Architecture-Agnostic Security View
- From Chiplet Design to Physical Reality: Why AI Hardware Needs Continuous Engineering Intelligence
- Polaris Electro-Optics Secures $50M Series B to Scale Next-Gen Optical Engine Platform for AI Infrastructure
- Arteris Accelerates Industry Transition to Multi-Die Chiplet-Based Architecture
- Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging
- A Unified Interconnection Network for Chiplet-Based Scaling of the BrainScaleS Neuromorphic System
- Fujitsu launches made-in-Japan next-generation CPU FUJITSU-MONAKA and Fujitsu MONAKA Server for sovereign AI infrastructure
- Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem
- Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP
- Alchip Technologies Showcases Advanced ASIC Design and Packaging at AI Infra Summit 2026
- NcodiN Appoints Carlo Guareschi as Chief Business Officer, Yacine Halioua as Chief Product Officer, and Zachary Cho as General Manager, France
- From Transistors to AI: The Chiplet Revolution with Ramune Nagisetty
- Scaling AI with Chiplets & CPO