Building Real Confidence in Chiplet Stacks with Evelyn Landman of proteanTecs

Chiplets aren't just a trend anymore, they're becoming the default architecture for the AI era. But as the industry stacks more dies into a single package to keep up with AI and HPC demands, it's inheriting a reliability problem nobody has fully solved: when four, eight, or more dies from different processes (and sometimes different vendors) share one package, a single weak link can disqualify the entire stack — and the cost of that failure is enormous.

In this episode, OCP's Rob Coyle sits down with Evelyn Landman, co-founder and CTO of proteanTecs, to unpack why "known-good-die" testing is no longer enough and what it actually takes to reach "known-good-stack" confidence. They get into the hidden risks of multi-die packaging — thermal coupling, voltage droop, mechanical stress from through-silicon vias, and interface faults that traditional pass/fail testing simply can't catch — and how embedded telemetry is giving engineers real visibility inside the package, from bring-up and debug all the way through in-field operation.

In this conversation:

• Why AI, HBM, and co-packaged optics are forcing the move to multi-die packages
• How "shift-left" testing catches faults before you commit to an expensive package
• Mix-and-match and binning: building a more consistent, higher-performing stack
• What embedded telemetry reveals that lab-condition pass/fail testing misses
• Real-time actuation and fleet-level predictive maintenance in the field
• How power and thermal insight extends useful life across data centers, automotive, and physical AI
• The role of OCP's Open Chiplet Economy in moving from siloed integration to open, interoperable chiplet operations

Interested in the chiplet ecosystem? Reach out to Evelyn and the proteanTecs team, and get involved with the Open Chiplet Economy work stream at the Open Compute Project.

Chapters

• 00:00 Intro: chiplets as the default AI-era architecture
• 01:11 What's pushing the industry to modular dies
• 03:22 The hidden cost: the problem shifts to the package
• 04:56 Shift-left: catching faults before you package
• 05:28 Single-die pass/fail vs. multi-die reality
• 07:25 Where reliability breaks down in the field today
• 10:06 What "known-good-stack" confidence looks like
• 12:20 Mix-and-match and binning before assembly
• 15:37 Embedded telemetry vs. traditional pass/fail
• 17:30 Thermals, hotspots, and heat-sensitive optics & memory
• 19:54 Real-time actuation to prevent imminent failure
• 20:59 Board- and fleet-level predictive maintenance
• 24:43 Scaling to millions of devices, tighter margins
• 27:16 OCP's Open Chiplet Economy & the road ahead