From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands
What does it take for one of the world's most complex engineering organisations to commit — fully — to 3D IC as a strategic direction? And what does that commitment reveal about the gaps the entire industry still needs to close?
In this episode of the Siemens 3D IC Podcast, host Tova Levy speaks with Sujit Sharan, Intel Fellow in the Advanced Packaging Technology & Manufacturing Organization at Intel Corporation, one of the industry's foremost voices on making 3D IC real at production scale. Discover what forces drive Intel's 3D IC strategy, how it manages complexity and cultural resitstance, and what the ultimate EDA goal is.
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- From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands