From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands
What does it take for one of the world's most complex engineering organisations to commit — fully — to 3D IC as a strategic direction? And what does that commitment reveal about the gaps the entire industry still needs to close?
In this episode of the Siemens 3D IC Podcast, host Tova Levy speaks with Sujit Sharan, Intel Fellow in the Advanced Packaging Technology & Manufacturing Organization at Intel Corporation, one of the industry's foremost voices on making 3D IC real at production scale. Discover what forces drive Intel's 3D IC strategy, how it manages complexity and cultural resitstance, and what the ultimate EDA goal is.
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related Videos
- The hidden heat challenge of 3D IC: and what designers need to know
- The Siemens SIPI approach: From feasibility to final closure in 3D IC design
- From 2.5D to true 3D IC: What's driving the next wave of integration
- From chips to silicon destiny: The next wave of 3D IC
Latest Videos
- From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands
- Advancing 3DIC Technologies to Propel AI Innovations
- Building Real Confidence in Chiplet Stacks with Evelyn Landman of proteanTecs
- Advanced Packaging: Enabling AI at Scale
- Accelerating Chiplet Design with OCP Standards Compliant Chiplet Framework and Automation