On Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low-Power, High-Bandwith, Low-Latency and Low-Cost Approach
By Debendra Das Sharma, Swadesh Choudhary, Peter Onufryk (Intel) and Robert Pelt (AMD)
On Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low-Power, High-Bandwith, Low-Latency and Low-Cost Approach
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