Advancing 3DIC Technologies to Propel AI Innovations
Presenter: Dr. Jun He, VP of Advanced Packaging Technology and Service, TSMC
AI innovation has significantly increased the demand for advanced packaging solutions, which offer numerous benefits such as cost efficiency, design flexibility, and enhanced system performance. However, as AI product cycles accelerate toward an annual cadence, they present unprecedented challenges related to rapid development cycles, steep manufacturing ramps, and stringent system yield requirements. Therefore, ecosystem partnerships among chip designers, chiplet integrators, tool/material suppliers, HBM/substrate manufacturers, and system providers are essential to the continued advancement of packaging technologies for AI applications.
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