Advancing 3DIC Technologies to Propel AI Innovations
Presenter: Dr. Jun He, VP of Advanced Packaging Technology and Service, TSMC
AI innovation has significantly increased the demand for advanced packaging solutions, which offer numerous benefits such as cost efficiency, design flexibility, and enhanced system performance. However, as AI product cycles accelerate toward an annual cadence, they present unprecedented challenges related to rapid development cycles, steep manufacturing ramps, and stringent system yield requirements. Therefore, ecosystem partnerships among chip designers, chiplet integrators, tool/material suppliers, HBM/substrate manufacturers, and system providers are essential to the continued advancement of packaging technologies for AI applications.
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related Videos
- TSMC 3Dblox™: Unleashing 3D IC Innovations for the Next Generation of AI, HPC, Mobile and IoT
- Ready to Level-up your SOC/Chiplet Design? : Optimizing the IP-driven Approach
- How to Overcome Chiplet System Analysis Challenge
- Advancing AI: The Role of HBM in the Chiplet Ecosystem Era
Latest Videos
- Advancing 3DIC Technologies to Propel AI Innovations
- Building Real Confidence in Chiplet Stacks with Evelyn Landman of proteanTecs
- Advanced Packaging: Enabling AI at Scale
- Accelerating Chiplet Design with OCP Standards Compliant Chiplet Framework and Automation
- Chiplet Identity and Roots of Trust in FCSA Systems: An Architecture-Agnostic Security View