Introduction to UCIe Tutorial: Electrical, Form Factor, and Compliance

High-performance and power efficiency needs of emerging workloads demand on-package integration of heterogeneous processing units, memory, and electrical and optical interconnects. Applications such as artificial intelligence, machine learning, data analytics, 5G, automotive, and high-performance computing are driving these demands to meet the needs of cloud computing, intelligent edge, enterprise, client, and hand-held computing infrastructure. On-package interconnects are a critical component to deliver power-efficient performance with the right feature set in this evolving landscape. UCIe is an open industry standard with a fully specified stack that comprehends plug-and-play interoperability of chiplets on a package; similar to the seamless interoperability on board with well-established and successful off-package interconnect standards such PCI Express, Universal Serial Bus (USB), and Compute Express Link (CXL). 

In this tutorial, UCIe experts and spec developers will:  

•  discuss the usages and key metrics of UCIe
•  delve into electrical, packaging, protocol, RAS, and software aspects along with the compliance and interoperability mechanisms.