UCIe 2.0 Specification: Advancing an open ecosystem for on-package chiplet innovation
By Debendra Das Sharma, UCIe Consortium Chairman
UCIe™ (Universal Chiplet Interconnect Express™) is an open industry that defines the interconnect offering high-bandwidth, low-latency, power-efficient, and cost-effective on-package connectivity between chiplets.
The UCIe 1.1 Specification delivers valuable improvements that extend reliability mechanisms, provide enhancements for the automotive industry, enable lower-cost implementations, and establish compliance and interoperability testing specifications to establish a vibrant chiplet ecosystem.
During this presentation, Debendra Das Sharma, UCIe Consortium Chairman, will provide an update on the UCIe Consortium and highlight progress in the specification.
Related Chiplet
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