Introduction to Semiconductor Packaging
By Hans Manhaeve
This is Episode 1 in the Europractice webinar series 'From Packaging to Heterogeneous Integration'.
Packaging has evolved from a simple means of protecting a chip into a key technology that determines product performance, reliability, integration capability, and cost.
This introductory session provides a high-level overview of the journey from silicon to product, explaining the role of packaging and testing. You will discover the major packaging technologies used today, ranging from conventional packages to advanced solutions such as wafer-level packaging, system-in-package, chiplets, and 2.5D/3D integration.
Whether you are new to packaging or looking to broaden your system-level perspective, this session will provide the essential framework for the detailed discussions that follow.
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