Federated Chiplet Design and Simulation

Kevin Cameron, Consultant, Cirrus Logic
David Ratchkov, CTO, Palo Alto Electron

The success of an open chiplet ecosystem depends not only on physical interoperability but also on the ability to exchange design intent, constraints, interfaces, and integration requirements across organizational boundaries. As semiconductor systems become increasingly modular, efficient design exchange becomes critical for enabling collaboration among chiplet providers, integrators, EDA vendors, manufacturers, and end users. This session provides an update on Design Exchange activities within the Open Chiplet Economy and reviews progress toward standardized methods for describing chiplets, packages, interfaces, constraints, and integration metadata. The discussion will examine current challenges, ongoing industry collaboration, and opportunities to improve portability, automation, and interoperability across heterogeneous development flows. The session will focus on ecosystem enablement and practical adoption considerations for scalable chiplet integration.