Fast-Forward Verification: Scaling Chiplet Simulations with Xcelium
As chiplet-based designs grow in complexity, traditional simulation methods are hitting performance limits. Enter Cadence’s Xcelium Distributed Simulation App—a breakthrough that speeds up multi-die simulations by up to 3x. In this episode, we explore how distributed simulation is transforming verification workflows, enabling faster debug cycles, and helping teams meet aggressive tapeout schedules. We’ll break down how the technology works, where it fits in the verification flow, and what it means for the future of scalable, high-performance design.
Speakers:
- Anika Sunda, Director, Product Management, Cadence
- Sunil Kashide, Director, Chip Design Verification, Samsung Semiconductor India Research
- Prashant Teotia, Director, Product Engineering, Cadence
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Unleashing Chiplet potential with BoW - "The Knot That Ties Chiplets Together"
- Charting Architectural Innovation in the Chiplet Era with OCP's Cliff Grossner
- Intel's Optical I/O Chiplet Co-Packaged with Server CPU
- Enabling an Open Chiplet Ecosystem with UCIe
Latest Videos
- 2026 Predictions from Alpahwave Semi, now part of Qualcomm
- Arm Viewpoints: Chiplets explained – the technology and economics behind the next wave of silicon innovation
- The State of Multi-Die: Insights and Customer Requirements
- Coding approaches for increasing reliability and energy efficiency of 3D technologies
- AI-Driven Thermal Prediction for Enhanced Reliability in 3D HBM Chiplets