Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning
January 7, 2026
Chiplet Technical Library
Whitepapers & Technical Articles
High-Efficient and Fast-Response Thermal Management by Heterogeneous Integration of Diamond on Interposer-Based 2.5D Chiplets
January 5, 2026
HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement
January 5, 2026
A physics-constrained and data-driven approach for thermal field inversion in chiplet-based packaging
December 30, 2025
Videos
Coding approaches for increasing reliability and energy efficiency of 3D technologies
December 30, 2025
AI-Driven Thermal Prediction for Enhanced Reliability in 3D HBM Chiplets
December 29, 2025
Rearchitecting AI Infrastructure with General Purpose and Accelerator Chiplets
December 17, 2025
UCIe Based Chiplet Ecosystem Interoperable Testbench for Multi Vendor IP Integration
December 17, 2025
Slides
The Right Testing Strategy Can Save Designs
February 24, 2025
Accelerating AI Chip Development with 3D Multi-Die Designs
February 12, 2025
Scaling Connectivity for Chiplet-Based AI Systems
February 11, 2025
5 key reasons… Chiplet (die-2-die) interfaces require specialty I/O circuits and custom ESD protection
February 7, 2025