Podcast: How Achronix is Enabling Multi-Die Design and a Chiplet Ecosystem with Nick Ilyadis
Dan is joined by Nick Ilyadis, vice president of product planning at Achronix. Prior to Achronix, Nick was vice president of portfolio and technology strategy at Marvell Semiconductor and vice president and group CTO at Broadcom. Nick has also held many engineering roles during his career, starting as a chip designer and moving up through management to lead both device and product engineering teams. Nick is passionate about technology and a prolific inventor with 75 issued patents across all aspects of wired and wireless communications.
Nick describes how Achronix FPGA technology is enabling new types of designs with a focus on AI enablement. The strategies used to develop multi-die, chiplet-based designs and the various ways Achronix is making new design approaches a reality through technology development and partnerships are also discussed.
Related Chiplet
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
- 400G Transmitter Chiplet for 400G, 800G and 1.6T Pluggable Transceivers
- FPGA Chiplets with 40K -600K LUTS
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- Jumpstarting the Automotive Chiplet Ecosystem
- Chiplet ecosystems enable multi-vendor designs
- Three Key Takeaways from the First Annual Chiplet Summit
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