TSMC 3Dblox™: Unleashing 3D IC Innovations for the Next Generation of AI, HPC, Mobile and IoT
TSMC's Jim Chang took the stage at the 2023 TSMC Technology Symposium to talk about TSMC 3Dblox™, a standard to address the rising complexity of 3D IC design and unify the design ecosystem with qualified EDA tools and flows for TSMC 3DFabric technology. The modularized TSMC 3Dblox standard is designed to model, in one format, the key physical stacking and the logical connectivity information in 3D IC designs. TSMC has worked with EDA partners in the 3DFabric alliance to enable 3Dblox for every aspect of 3D IC designs, including physical implementation, timing verification, physical verification, electro-migration IR drop (EMIR) analysis, thermal analysis, and more. TSMC 3Dblox is designed to maximize flexibility and ease of use, offering ultimate 3D IC design productivity.
Related Videos
- Architecting Next Generation Compute and I/O Chiplet for AI/ML, Cloud and Edge Platforms
- Chiplets for the future of AI
- Connectivity for AI Everywhere: The Role of Chiplets
- Impact of Chiplets, Heterogeneous Integration and Modularity on AI and HPC systems
Latest Videos
- Revolutionizing SoC Design: The Shift to Chiplet-Based Architectures
- Embedded World, Nuremberg: Arm’s Suraj Gajendra on AI, Chiplets, and the Future of Automotive Compute
- Keysight Expands Chiplet Interconnect Support with UCIe 2.0 & BoW
- Revolutionizing AI & Chiplets: Baya Systems CEO on $36M Series B, UALink, Future of Data Movement
- Machine Learning Applications in EDA for Chiplet Reliability