MSquare Technology: Enabling Packaging and Interconnect Chiplet IP
In this video interview, EE Times sits down with Sean Wang, one of the co-founders and a VP for MSquare Technology, to discuss the background of the young company, first established in 2021, which he says was a result of a lack of choices for interconnect IP geared toward high speed interfaces in China.
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Videos
- Exploring the Advancement of Chiplet Technology and the Ecosystem
- Exploring the Advancement of Chiplet Technology and the Ecosystem
- Tutorial: Introduction to Chiplet Interconnect Test and Repair
- Blue Cheetah BlueLynx for Heterogeneous Integration: 16 Gbps Chiplet Interconnect IP for UCIe & BoW