Exploring the Advancement of Chiplet Technology and the Ecosystem

Semiconductor companies are making transistors smaller and cramming more into chips to meet the demands of today’s high-tech industries and applications. In fact, in a recent article from the Financial Times, technology industry consultants McKinsey forecast that semiconductors will become a trillion-dollar industry by the end of this decade. Even with this massive growth, manufacturers recognize the need to balance costs with chip performance and are working to solve this challenge by shifting toward chiplet manufacturing – creating smaller, modular chiplets, designed for a specific function, that can be connected to build a larger system. Chiplets enable design flexibility for end-users seeking to match chip designs based on requirements.

UCIe™ (Universal Chiplet Interconnect Express™) provides an industry standard for interface and is driving the adoption of chiplet technology. The open specification defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.

This webinar aims to explore the industry trends that prompted the development of chiplet technology and how an interoperable solution meets industry demand. Our panelists will also discuss how UCIe fosters collaboration in the industry toward the future of chiplet innovation in markets such as AI, ML, aerospace, and automotive.

Moderator: Brian Rea (UCIe Marketing Workgroup Co-Chair, Intel)
Panelists: Ericles Rodrigues Sousa (UCIe Automotive Workgroup Co-Chair, Cadence Design Systems), Hee-Soo Lee (Keysight Technolgies), and Saman Sadr (Neuron IP)