Driving AI Innovation with Chiplet Standards
How are chiplet standards evolving to enable an open ecosystem? Jawad Nasrullah, CEO from Palo Alto Electron and Open Chiplet Economy Sub-Project Co-Lead for Open Compute Project, explains:
- Die-to-die communication standards like Bunch of Wires (BOW) are laying the foundation for modern chiplet interconnect specifications
- New standardized design languages like CCDXML enable cross-vendor tool compatibility for chiplet integration
- Development of chiplet socket standards addresses power delivery, bump maps, and mechanical specifications for large-scale systems
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
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