Driving AI Innovation with Chiplet Standards

How are chiplet standards evolving to enable an open ecosystem? Jawad Nasrullah, CEO from Palo Alto Electron and Open Chiplet Economy Sub-Project Co-Lead for Open Compute Project, explains:

• Die-to-die communication standards like Bunch of Wires (BOW) are laying the foundation for modern chiplet interconnect specifications
• New standardized design languages like CCDXML enable cross-vendor tool compatibility for chiplet integration
• Development of chiplet socket standards addresses power delivery, bump maps, and mechanical specifications for large-scale systems