System-in-Package (SiP)
System-in-Package (SiP) is a cutting-edge semiconductor packaging technology that integrates multiple chips and passive components into a single compact module. SiP enables high functionality, miniaturization, and optimized performance, making it ideal for smartphones, wearables, IoT devices, automotive electronics, and high-performance computing applications.
What Is System-in-Package (SiP)?
System-in-Package (SiP) is a technology that combines multiple integrated circuits (ICs), passive components, and interconnects into one package. Unlike traditional multi-chip modules, SiP uses advanced 3D stacking or side-by-side layouts to achieve a smaller footprint, better performance, and lower power consumption.
SiP allows engineers to build highly integrated systems without the cost and complexity of creating a single large monolithic chip.
Related Articles
- Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration
- High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express
- Development and Optimization of Fine-Pitch RDL for RDL Interposer, and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology
- System-Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution
- REED: Chiplet-based Accelerator for Fully Homomorphic Encryption
Related Blogs
- Intel Foundry Collaborates with Partners to Drive an Open Chiplet Marketplace
- What Is 3D-IC Technology? Fundamentals, Architecture, and Design Concepts
- Introduction to Chiplets: Why the Industry is Moving Beyond Monolithic Designs
- The Chiplet Calculus: Navigating the Integration Crisis at the Hardware.AD Frontier
- Streamlining Functional Verification for Multi-Die and Chiplet Designs
Featured Content
- Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
- 2026 Predictions from Alpahwave Semi, now part of Qualcomm
- CoAsia SEMI Commences Supply of 3D IC SoCs: Korea’s First Case, Positioning 3D IC as the Next HBM
- Eliyan Secures $50 Million in Strategic Investments from Leading Hyperscalers and AI Infrastructure Providers to Accelerate Scalable AI Systems
- Lifecycle Cost-Effectiveness Modeling for Redundancy-Enhanced Multi-Chiplet Architectures
- Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics
- DISTIL: A Distributed Spiking Neural Network Accelerator on 2.5D Chiplet Systems
- Building out the Photonic Stack
- Lightmatter Introduces Guide Light Engine for AI, Featuring VLSP Technology
- Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers
- Lightmatter Collaborates with Synopsys to Integrate Advanced Interface IP with Its Passage Co-Packaged Optics Platform
- Lightmatter and Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure
- Hybrid Bonding Comes of Age Slowly and Collectively
- Tenstorrent Announces Participation in CHASSIS Program
- LIGENTEC and X-FAB Expand Integrated Photonics Offering with SOI and Thin-Film Lithium Niobate Volume Scaling